Lead-free reflow soldering production temperature was significantly higher than that of lead-reflow, the cooling function of the device put forward higher requirements. Controllable faster cooling rate can make the structure of lead-free solder joints more dense, to improve the mechanical strength of solder joints to bring help.

Especially when we produce circuit boards with large heat capacity such as communication backplanes, if we only use the air-cooling method, it will be very difficult for the circuit boards to cool at a cooling rate of 3-5 degrees Celsius / second while the cooling rate will not reach Requirements will make the structure of the solder loose, but directly affect the reliability of solder joints. Therefore, lead-free production is more recommended to consider the use of dual-cycle water-cooled device, while the cooling slope of the equipment should be required to set and fully controllable.

Lead-free reflow solder paste is often added more flux, flux residue easily accumulated inside the furnace, affecting the heat transfer performance of the equipment, and sometimes even fall to the furnace circuit board above the pollution. There are two ways to remove flux residues during production:

1, exhaust ventilation

Exhausting is the easiest way to remove flux residue. However, excessive exhaust will affect the stability of hot air flow in the furnace cavity. In addition, increasing the exhaust air flow will directly lead to the increase of energy consumption (including electricity and nitrogen).

2, multi-level flux management system

Flux management systems generally include filtration and condensation devices. Filtration devices separate the solid particles in the flux residues from the filter. Cold devices condense gaseous flux residues into a liquid form in a heat exchanger, which is then pooled and concentrated in a collection tray.